The two-day EAC 2026 Autonomous Driving & Embodied Intelligence Industry Exhibition wrapped up successfully on May 28–29. Raysea showcased its core proprietary technologies and flagship products at the event. As an invited speaker at the Advanced LiDAR Technology Exchange Summit, the company delivered a keynote speech entitled Multi-junction High Power Density VCSEL Chips for LiDAR Applications, sharing forward-looking technological concepts and garnering robust onsite feedback and extensive industry recognition. Backed by outstanding technical strengths, the RayDrive automotive-grade high-power VCSEL laser chip claimed the Intelligent Sensing Innovation Technology Award at the EAC 2026 Intelligent Brilliance Awards.
Keynote Speech: Multi-junction High Power Density VCSEL Chips for LiDAR Applications
At the Advanced LiDAR Technology Exchange Summit, Liu Yujia, Director of Raysea, delivered the above-mentioned keynote, elaborating on four key modules: company profile, VCSEL product roadmap, differentiated core technologies and LiDAR market analysis.
Raysea is a high-tech enterprise focusing on the design, R&D and manufacturing of high-end VCSEL chips. Its core R&D team boasts world-class compound semiconductor process expertise, dedicated to developing high-performance optoelectronic chip solutions for automotive sensing, consumer electronics, data communication and other vertical industries.
In terms of VCSEL product layout, Raysea has established a comprehensive product portfolio ranging from single-junction to multi-junction variants and low-power to high-power-density specifications. Tailored for LiDAR applications, the company’s proprietary multi-junction VCSEL product series supports short-range blind-spot detection, mid-range ranging and long-range primary radar scenarios, with industry-leading metrics in peak optical power, electro-optic conversion efficiency and high-temperature durability.
For differentiated core technologies, Raysea adopts an innovative epitaxial structural design to realize single-oxide-layer process, breaking through the technical bottlenecks of multi-junction VCSELs concerning high power density, thermal management and long-term reliability, which renders the chips highly compatible with solid-state and hybrid solid-state LiDAR schemes.
From a market perspective, the global automotive LiDAR market is set to grow exponentially amid accelerated commercial rollout of autonomous driving, robotic navigation and smart transportation. High-power-density and high-reliability VCSEL chips are evolving into mainstream LiDAR light sources. Raysea’s multi-junction VCSEL lineup is poised to capture considerable share in this high-growth blue-ocean market and facilitate the high-end upgrading and independent controllability of domestic optoelectronic chips.
Honored with Intelligent Brilliance Award | RayDrive Automotive-grade High-power VCSEL Laser Chip Wins EAC 2026 Intelligent Sensing Innovation Technology Award.
As a flagship agenda of the exhibition, the selection of EAC 2026 Intelligent Brilliance Awards was assessed comprehensively from dimensions including technical innovation, product commercialization and industrial value. Benefiting from solid technical accumulation and superior product performance, the RayDrive automotive-grade high-power VCSEL laser chip stood out from numerous competing products with pioneering breakthroughs in LiDAR light-source technology and was conferred the Intelligent Sensing Innovation Technology Award.
This prestigious honor underpins Raysea’s core technological advantages in the automotive-grade VCSEL track and serves as authoritative industry affirmation of the product’s adaptability to autonomous driving and intelligent sensing applications.
In-depth Onsite Communication Fuels Mutually Beneficial Cooperation
During face-to-face onsite discussions, the Raysea team conducted in-depth exchanges with clients from across the industry covering industrial trends, market demands and prospective cooperation planning, laying a solid foundation for future collaborative development. Many partners expressed strong cooperation intent and intend to accelerate project docking to jointly explore market space and deliver win-win outcomes.
